放眼半导体产业发展史,产业主流已经从个人计算机时代,进入到目前以宽频网络与数字消费性电子主宰的时代;而每次的世代交替,也自然出现重新洗牌的竞争局面.在1991年成立的Broadcom(博通科技),成立以来每每以其SoC技术的整合能力,并购的扩展实力,以及产品优异的性价比,一路从以太网为主的企业家庭网络市场,扩大版图进入消费性宽带与无线网络等新兴市场,产品种类之广无人能敌,且多项产品线的市场份额居业界之冠,每次新品面市,总是带给竞争同业相当的压力,甚至带给业界设计上的新思维。
Take a look at the history of semiconductor industry, the mainstream of industry has shifted from PC world to broadband network and digital consumer electronics domains. Each alternation of generation also causes the huge riffle of players and the whole new competition aspect.
Broadcom Technology, funded in 1991, is a company initially focused on enterprise network market on Ethernet basis. By their outstanding SoC integration ability, mergers and acquisitions force and the excellent performance/price ratio, has expended successfully its business scope to the emerging market, such as the CE broadband and wireless network.
Broadcom has broadly product lines and many of them take the leading positions on market share. Every time the launch of new product always bring the high pressure to their competitors, and even create the new thoughts on design.
这家靠Cable modem与以太网交换器芯片起家的公司,迄今以太网相关产品所属的网络基础结构集团的业绩仍居其它事业群之首.日前网络基础结构集团推出新一代网络交换芯片StrataXGS III,再度突破了SoC技术整合的门坎,被视为是Broadcom以太网络的旗舰级产品,引起业界相当大的注目.
This is a company who grew up by cable modem and Ethernet switch chipsets. Nowadays, the sales results of Ethernet product still are the champ in all its business units. Because of the appearance of the new generation Ethernet switch chipset, taken as the flagship of Ethernet product, Broadcom breaks out the limit of SoC technology integration again. It gives rise to the great remarks in industry field.
无论从企业整体的经营策略,抑或网络产品的布局与技术实力,Broadcom的一举一动都引起外界对这家全球第二大的IC设计公司抱持高度兴趣,值StrataXGSIII在北京发表之际,本刊特别专访到Broadcom网络基础结构集团副总裁Ford G. Tamer博士,进一步了解Broadcom的竞争优势所在,以及他对这款极具产业代表性新品的看法.
No matter from corporate strategy aspect, position of network product or the technology force, Broadcom抯 every moving often evokes people抯 high interest to this second big worldwide IC design company. By the chance of launch of StrataXGSIII in Beijing, we have an interview with Ford G. Tamer, Ph.D.,Group Vice President, Networking Infrastructure, Broadcom, to see where their competitive advantages are and share his personal viewpoint about this meaningful new product.
Ethernet技术优势所在
Ethernet Technology Advantage
问:Broadcom对Ethernet此一历史悠久的技术产品策略为何?
Q:What is Broadcom?s strategy for Ethernet-this historical networking technology?
答:我们是Ethernet Switch的龙头,迄今我们已出货120万埠量.我们的策略是建构所有平台的要件,从物理层PHY,安全性,处理器,光学,供企业用的交换器,都会网络, 3G,甚至到DSLAM,以提供客户完整的产品阵容. 并且基于同样芯片,以软件贯串各种应用,这是我们的优势.同时,系统单芯片技术也是另一项重要优势,新推出的StrataXGSIII就是很好的例子.
A: We are Ethernet Switch leader, 1.2M ports has shipped so far. Our strategy is to offer all element of platform: such as switch PHY, Security, processor, optical, switch for enterprise, plane server, 3G,and DSLAM. We have many strong portfolios for customers. One of our advantages is based on same hardware chip, to use software across all the market. SoC is another big advantage, our new product- StrataXGSIII is a good example.
敢于投资研发成本的企业文化
Generous enterprise culture to invest R&D
问:除了网络产品,Broadcom的产品线相当广泛,是否表示贵公司想涵盖每个产品区隔成为龙头,如果是的话,你们是如何妥善利用技术与财务资源的?
Q: Besides of networking products, Broadcom has a wide range of product lines in other field. Does it mean you?d like to cover every segment as a pioneer? If so, how can you utilize your technology and financial resources?
答:现在一片纳米硅芯片的成本相当昂贵,投片90纳米的费用就要100万美金,65纳米的更贵.去年我们这个部门验证工具便花了1500万美金,我们公司花在研发的费用便占了营收的20%,这在其它企业相当罕见.2004年我们被FSA选为最受尊敬的企业.
A: It?s very expensive to produce a silicon wafer in nanometer process now,for example, the cost to tape-out a 90 nano process wafer is up to 1M USD,more for 65 nano?s. We spent 15MUSD for verification equipment last year. In total, R&D expense shares 20% of our revenue which is not common in other companies. We are selected by FSA (Fabless Semiconductor Association) as the most respected enterprise in 2004.
问:贵公司产品如何能拥有优异的价格竞争力?
Q: How can you have strong pricing competitive?
答:这归于我们有坚强的代工伙伴,整合的技术能力,还有保持与客户紧密的合作关系,才能提出正确的策略性计划.
A: That is because our strong foundry partners, integration capability, and keep close cooperative relationship with customers, so that our strategy without mistake.
充满机会的一年
A year of full of opportunity
问:业界对2005年半导体景气的看法多认为今年会是充满挑战的一年.您的看法为何?
Q: Most of the industrial people think it?s a challenging year for year 2005. What?s your point?
答:2004年对我们来说业绩成长亮丽,达到24亿美元的销售业绩,年成长率达到50％-60%.虽然竞争仍然激烈,我想以我们所居的优势, ,2005年机会仍相当多,而且会令我们相当满意.
A: It?s great for our sales revenue grew to 2.4B in year 2004, year to year growth rate is up to 50%-60%. Though the competition is still tough, we see quite a lot of opportunity and will make us satisfied based on our well-position.
问:能否谈一下你们的并购策略?
Q: Can you talk about your acquisition strategy?
答:目前为止我们已经并购30家公司,虽然数量不少,但这个策略不会停止,我们会一直寻找能对我们带来价值与互补的公司.
A: We?ve acquired more that 30 companies as far and it?s not few numbers. But we wont stop seeking for those companies can bring us value and complement with us.
问:你对大中华区市场有何期待?
Q: What do you expect to greater China market?
答:我们对大中华区市场相当重视, 此区营收仅次于美国地区.中国大陆地区市场相当大,我们已经在此投资多年,对中国台湾地区市场也不例外,不久前还设立了研发中心.
A: We are very focused on greater China market which revenue is the highest except of US market. China market is huge and we?ve invested here for many years. Taiwan is important market, too. We have set up a design center not long ago.
产品介绍
The new product overview
BROADCOM超强集成的以太网交换芯片解决方案
StrataXGS III—The Most highly Integrated Ethernet Switch Solutions
Broadcom公司此次发布最新的StrataXGS III交换芯片架构设计配置了完全集成的、速度最快、性能最强的以太网交换机芯片系列。秉承以往四代Broadcom以太网交换机的技术，新一代StrataXGS III交换机具有先进的多层每秒72Gb全双工包处理能力，率先将全面安全、线速IPv6路由及无线局域网支持等下一代StrataXGS III交换机产品独具的主要特征集成在一起。
Broadcom Corporation announced its new StrataXGS III switch architecture featuring the world‘s fastest, highest performing family of fully integrated Ethernet switch chips. Evolving from four prior generations of Broadcom Ethernet switch technology, the new StrataXGS III switches are the first to incorporate ubiquitous security, wire-speed IPv6 routing and wireless LAN support. The new StrataXGS III switch architecture features an advanced multi-layer 72 Gigabit per second (Gbps) full-duplex packet processing architecture. These next-generation capabilities are only available in StrataXGS III switches.
信息技术（IT）专业人员经常面临减少资金支出和降低网络基础设施运营费用的要求。为了达到这些目标，IT专业人员需要简化桌面PC、VoIP电话、无线局域网访问点和安全设施的管理。部署新应用以及融合语音、视频和数据的要求，使得对可靠、安全和高性能网络的需求更加迫切。由于以太网交换的广泛应用和高性价比，它是实现这种融合最普及的解决方案。StrataXGS III以太网交换机芯片凭借其优越的性能和增强的安全特性进一步加速了这种融合，为企业级和运营商级环境提供所要求的可靠性。
Information Technology (IT) professionals are often required to minimize capital expenditures and reduce operating costs of network infrastructures. To achieve these objectives, IT professionals need to simplify the management of desktop PCs, VoIP phones, wireless LAN access points and security appliances. The deployment of new applications, as well as the convergence of voice, video and data, has intensified the need for reliable, secure, high performance networks. Ethernet switching is the most pervasive solution to achieve this convergence due to its wide use and cost-effectiveness. The StrataXGS III Ethernet switch chips further accelerate this convergence through their superior performance and enhanced security features, delivering the reliability demanded by enterprise and carrier environments.
Broadcom公司此次发布的是StrataXGS III的第一个产品系列，即500系列，专为多功能、高性能的GbE和10GbE交换机应用所设计。56500系列包括5种新芯片，即BCM56500、BCM56501、BCM56502、BCM56503 及 BCM56504，每款芯片针对不同的端口和功能需求。旗舰产品BCM56504是业界惟一能够集成24个GbE埠和4个10GbE端口于单一芯片的产品。这是基于网络集成商需要支持并发堆栈和冗余10GbE上行链路而专门配置的。每一GbE埠能以10/100/1000 Megabits模式工作，而每一10GbE端口能够以10GbE模式或堆栈模式工作。此外，BCM56504是基于每秒可处理超过1亿包的72Gbps包处理器，这一能力在集成多层交换机领域无可匹敌。
Announced product is the first StrataXGS III product family, the 500 Series. Designed for feature-rich, high performance Gigabit Ethernet (GbE) and 10GbE switch applications, the 500 Series includes five new chips, the BCM56500, BCM56501, BCM56502, BCM56503 and BCM56504, each targeting different port and functionality requirements. The flagship product, the BCM56504, is the only switch in the industry to incorporate 24 GbE ports and four 10GbE ports in a single-chip device. This specific configuration is required by network integrators to support concurrent stacking and redundant 10GbE uplinks. Each GbE port can operate at 10/100/1000 Megabits per second (Mbps) while each 10GbE port can operate in either 10GbE mode or stacking mode. Additionally, the BCM56504 is based on a 72 Gbps packet processor that is capable of processing over 100 million packets per second, which is unrivaled for integrated multi-layer switches.
Ford G. Tamer.表示：“通过StrataXGS III产品，我们正在提供一种令人振奋的新一代交换机芯片，它能够在单个的高性能网络上实现话音、视频和数据流的安全可靠通讯。继承StrataSwitch和StrataXGS前几代产品成功的模式，StrataXGS III将多项独到的技术集于一体，这些技术将在未来几年为世界最先进的企业和运营商网络提供动力。”
"With StrataXGS III, we are delivering an exciting new generation of switching silicon that enables reliable and secure communication of voice, video and data traffic on a single high-performance network," said Ford G. Tamer, Ph.D.,Group Vice President, Networking Infrastructure, Broadcom. "Building on the success formula of the previous generations of StrataSwitch and StrataXGS, StrataXGS III features an impressive collection of unique technologies that will power the world‘s most advanced enterprise and carrier networks over the next several years."
致力于丰富的安全性、弹性和融合统一的网络
Focus on Robust Security, Resiliency and Converged Unified Networking
随着公众网络和公司网络受到更加频繁的针对性攻击，Broadcom给与充分的响应，通过在所有StrataXGS III产品上集成大量独一无二的基于安全的智能，而实现具有弹性的、安全可靠的网络连接。Broadcom设计了独特的线速2层到7层对应用感知的安全技术，这一基于灵活可编程规则的技术加强了安全策略。另一个产品特性是集成了防止拒绝服务攻击的技术，即使受到攻击也能保证连续的服务。为了在所有的StrataXGS III产品中确保安全功能，先进的密码加密技术也被集成其中，满足美国联邦政府FIPS 140-2标准所规定的严格要求。
With the increasing rate of targeted attacks on public and corporate networks, Broadcom has responded to the need for resilient secure networking by integrating a wealth of unique security-based intelligence into all StrataXGS III products. Broadcom‘s exclusive wire-speed Layer 2 to Layer 7 application-aware security technology is designed to enforce secure policies based on a flexible variety of programmable rules. Also featured is integrated Denial of Service attack prevention technology that provides continuity of service to users in case of an attack. To complete the security features within all StrataXGS III products, advanced cryptographic technology is integrated that meets the stringent requirements defined by the U.S. Government‘s FIPS 140-2 standard.
基于下一代安全特征，StrataXGS III架构能实现无线和有线基础设施的无缝集成。过去，由于涉及管理分散的WLAN网络和配置昂贵设备的开支及复杂性，WLAN的使用曾受到限制。StrataXGS III架构通过集成安全的WLAN服务和快速的漫游技术而解决这些问题，消除对昂贵设备的需求。因此，IT专业人员可以在一体化的网络中配置成本合理且易于管理的WLAN服务，比如新的VoIP无线电话服务。
Building upon next-generation security features, the StrataXGS III architecture enables seamless integration of a unified wireless and wired infrastructure. In the past, WLAN adoption has been limited due to the cost and complexity of deploying expensive appliances and managing a separate WLAN network. The StrataXGS III architecture solves these problems by integrating secure WLAN services and fast roaming technology, eliminating the need for costly appliances. As a result, IT professionals can now deploy cost-effective and easy to manage WLAN services, such as new VoIP wireless phones, on a single unified network.
由于因特网难以置信地持续增长，估计不久即将面临IPv4地址短缺。一个称为IPv6的新协议解决方案可以提供几乎无限制的地址空间。为了支持这种技术趋势，StrataXGS III架构提前实现技术的迁移，完全集成了IPv4和IPv6路由功能。采用这一高性价比技术能够帮助企业和服务提供商的网络实现轻松而平滑移植到IPv6。另外，智慧IP多播业务同样是StrataXGS III交换机的特点，它可以让服务提供商提供三种新类型（话音、视频和数据）的服务能力和视频播放服务。
As the Internet continues to experience incredible growth, it is expected that there will be a shortage of IPv4 addresses in the future, prompting a new protocol solution called IPv6 that provides virtually unlimited address space. In support of this trend, the StrataXGS III architecture is ahead of this transition by fully integrating both IPv4 and IPv6 routing capabilities. This cost-effective implementation will enable the easy migration to IPv6 in corporate and service provider networks. In addition, intelligent IP multicast technology is also featured within StrataXGS III switches, enabling service providers to offer new triple play capabilities (voice, video and data) and video broadcasting services.
为了降低系统开发成本和缩短产品投入市场时间，Broadcom提供一个完整的API （应用程序接口），它保持了和以往几代Broadcom交换机软件包的兼容性。除了提供一个公共的API，Broadcom为 StrataXGS III产品系列提供参考设计，包括软件、图表、规划文件和相关文档。
To reduce system development costs and accelerate time to market, Broadcom provides a comprehensive application programming interface (API) that maintains software compatibility with previous generations of Broadcom switches. In addition to providing a common API, Broadcom provides reference designs for the StrataXGS III product series including software, schematics, layout files and related documentation.
StrataXGS III应用
StrataXGS III交换机芯片系列非常适合单机、可堆栈及机架交换机配置方式，充分适应企业、服务提供商和网格计算的市场需求。另外，这些设备非常适合刀片服务器、IP DSLAM(IP协议数字用户线访问多路器)、PON（无源光网络）和AdvancedTCA（高级电信计算架构）等嵌入式应用，提供可靠的局部、背板和机板间的交换。
Application
The StrataXGS III family of switch chips is ideal for standalone, stackable and chassis switch configurations supporting enterprise, service provider and grid computing markets. In addition, these devices are well-suited for use in embedded applications such as blade servers, IP DSLAM (Internet protocol digital subscriber line access multiplexers), PON (passive optical networking), and Advanced TCA (Advanced telecom computing architecture), providing reliable local, backplane and inter-shelf switching.
Take a look at the history of semiconductor industry, the mainstream of industry has shifted from PC world to broadband network and digital consumer electronics domains. Each alternation of generation also causes the huge riffle of players and the whole new competition aspect.
Broadcom Technology, funded in 1991, is a company initially focused on enterprise network market on Ethernet basis. By their outstanding SoC integration ability, mergers and acquisitions force and the excellent performance/price ratio, has expended successfully its business scope to the emerging market, such as the CE broadband and wireless network.
Broadcom has broadly product lines and many of them take the leading positions on market share. Every time the launch of new product always bring the high pressure to their competitors, and even create the new thoughts on design.
这家靠Cable modem与以太网交换器芯片起家的公司,迄今以太网相关产品所属的网络基础结构集团的业绩仍居其它事业群之首.日前网络基础结构集团推出新一代网络交换芯片StrataXGS III,再度突破了SoC技术整合的门坎,被视为是Broadcom以太网络的旗舰级产品,引起业界相当大的注目.
This is a company who grew up by cable modem and Ethernet switch chipsets. Nowadays, the sales results of Ethernet product still are the champ in all its business units. Because of the appearance of the new generation Ethernet switch chipset, taken as the flagship of Ethernet product, Broadcom breaks out the limit of SoC technology integration again. It gives rise to the great remarks in industry field.
无论从企业整体的经营策略,抑或网络产品的布局与技术实力,Broadcom的一举一动都引起外界对这家全球第二大的IC设计公司抱持高度兴趣,值StrataXGSIII在北京发表之际,本刊特别专访到Broadcom网络基础结构集团副总裁Ford G. Tamer博士,进一步了解Broadcom的竞争优势所在,以及他对这款极具产业代表性新品的看法.
No matter from corporate strategy aspect, position of network product or the technology force, Broadcom抯 every moving often evokes people抯 high interest to this second big worldwide IC design company. By the chance of launch of StrataXGSIII in Beijing, we have an interview with Ford G. Tamer, Ph.D.,Group Vice President, Networking Infrastructure, Broadcom, to see where their competitive advantages are and share his personal viewpoint about this meaningful new product.
Ethernet技术优势所在
Ethernet Technology Advantage
问:Broadcom对Ethernet此一历史悠久的技术产品策略为何?
Q:What is Broadcom?s strategy for Ethernet-this historical networking technology?
答:我们是Ethernet Switch的龙头,迄今我们已出货120万埠量.我们的策略是建构所有平台的要件,从物理层PHY,安全性,处理器,光学,供企业用的交换器,都会网络, 3G,甚至到DSLAM,以提供客户完整的产品阵容. 并且基于同样芯片,以软件贯串各种应用,这是我们的优势.同时,系统单芯片技术也是另一项重要优势,新推出的StrataXGSIII就是很好的例子.
A: We are Ethernet Switch leader, 1.2M ports has shipped so far. Our strategy is to offer all element of platform: such as switch PHY, Security, processor, optical, switch for enterprise, plane server, 3G,and DSLAM. We have many strong portfolios for customers. One of our advantages is based on same hardware chip, to use software across all the market. SoC is another big advantage, our new product- StrataXGSIII is a good example.
敢于投资研发成本的企业文化
Generous enterprise culture to invest R&D
问:除了网络产品,Broadcom的产品线相当广泛,是否表示贵公司想涵盖每个产品区隔成为龙头,如果是的话,你们是如何妥善利用技术与财务资源的?
Q: Besides of networking products, Broadcom has a wide range of product lines in other field. Does it mean you?d like to cover every segment as a pioneer? If so, how can you utilize your technology and financial resources?
答:现在一片纳米硅芯片的成本相当昂贵,投片90纳米的费用就要100万美金,65纳米的更贵.去年我们这个部门验证工具便花了1500万美金,我们公司花在研发的费用便占了营收的20%,这在其它企业相当罕见.2004年我们被FSA选为最受尊敬的企业.
A: It?s very expensive to produce a silicon wafer in nanometer process now,for example, the cost to tape-out a 90 nano process wafer is up to 1M USD,more for 65 nano?s. We spent 15MUSD for verification equipment last year. In total, R&D expense shares 20% of our revenue which is not common in other companies. We are selected by FSA (Fabless Semiconductor Association) as the most respected enterprise in 2004.
问:贵公司产品如何能拥有优异的价格竞争力?
Q: How can you have strong pricing competitive?
答:这归于我们有坚强的代工伙伴,整合的技术能力,还有保持与客户紧密的合作关系,才能提出正确的策略性计划.
A: That is because our strong foundry partners, integration capability, and keep close cooperative relationship with customers, so that our strategy without mistake.
充满机会的一年
A year of full of opportunity
问:业界对2005年半导体景气的看法多认为今年会是充满挑战的一年.您的看法为何?
Q: Most of the industrial people think it?s a challenging year for year 2005. What?s your point?
答:2004年对我们来说业绩成长亮丽,达到24亿美元的销售业绩,年成长率达到50％-60%.虽然竞争仍然激烈,我想以我们所居的优势, ,2005年机会仍相当多,而且会令我们相当满意.
A: It?s great for our sales revenue grew to 2.4B in year 2004, year to year growth rate is up to 50%-60%. Though the competition is still tough, we see quite a lot of opportunity and will make us satisfied based on our well-position.
问:能否谈一下你们的并购策略?
Q: Can you talk about your acquisition strategy?
答:目前为止我们已经并购30家公司,虽然数量不少,但这个策略不会停止,我们会一直寻找能对我们带来价值与互补的公司.
A: We?ve acquired more that 30 companies as far and it?s not few numbers. But we wont stop seeking for those companies can bring us value and complement with us.
问:你对大中华区市场有何期待?
Q: What do you expect to greater China market?
答:我们对大中华区市场相当重视, 此区营收仅次于美国地区.中国大陆地区市场相当大,我们已经在此投资多年,对中国台湾地区市场也不例外,不久前还设立了研发中心.
A: We are very focused on greater China market which revenue is the highest except of US market. China market is huge and we?ve invested here for many years. Taiwan is important market, too. We have set up a design center not long ago.
产品介绍
The new product overview
BROADCOM超强集成的以太网交换芯片解决方案
StrataXGS III—The Most highly Integrated Ethernet Switch Solutions
Broadcom公司此次发布最新的StrataXGS III交换芯片架构设计配置了完全集成的、速度最快、性能最强的以太网交换机芯片系列。秉承以往四代Broadcom以太网交换机的技术，新一代StrataXGS III交换机具有先进的多层每秒72Gb全双工包处理能力，率先将全面安全、线速IPv6路由及无线局域网支持等下一代StrataXGS III交换机产品独具的主要特征集成在一起。
Broadcom Corporation announced its new StrataXGS III switch architecture featuring the world‘s fastest, highest performing family of fully integrated Ethernet switch chips. Evolving from four prior generations of Broadcom Ethernet switch technology, the new StrataXGS III switches are the first to incorporate ubiquitous security, wire-speed IPv6 routing and wireless LAN support. The new StrataXGS III switch architecture features an advanced multi-layer 72 Gigabit per second (Gbps) full-duplex packet processing architecture. These next-generation capabilities are only available in StrataXGS III switches.
信息技术（IT）专业人员经常面临减少资金支出和降低网络基础设施运营费用的要求。为了达到这些目标，IT专业人员需要简化桌面PC、VoIP电话、无线局域网访问点和安全设施的管理。部署新应用以及融合语音、视频和数据的要求，使得对可靠、安全和高性能网络的需求更加迫切。由于以太网交换的广泛应用和高性价比，它是实现这种融合最普及的解决方案。StrataXGS III以太网交换机芯片凭借其优越的性能和增强的安全特性进一步加速了这种融合，为企业级和运营商级环境提供所要求的可靠性。
Information Technology (IT) professionals are often required to minimize capital expenditures and reduce operating costs of network infrastructures. To achieve these objectives, IT professionals need to simplify the management of desktop PCs, VoIP phones, wireless LAN access points and security appliances. The deployment of new applications, as well as the convergence of voice, video and data, has intensified the need for reliable, secure, high performance networks. Ethernet switching is the most pervasive solution to achieve this convergence due to its wide use and cost-effectiveness. The StrataXGS III Ethernet switch chips further accelerate this convergence through their superior performance and enhanced security features, delivering the reliability demanded by enterprise and carrier environments.
Broadcom公司此次发布的是StrataXGS III的第一个产品系列，即500系列，专为多功能、高性能的GbE和10GbE交换机应用所设计。56500系列包括5种新芯片，即BCM56500、BCM56501、BCM56502、BCM56503 及 BCM56504，每款芯片针对不同的端口和功能需求。旗舰产品BCM56504是业界惟一能够集成24个GbE埠和4个10GbE端口于单一芯片的产品。这是基于网络集成商需要支持并发堆栈和冗余10GbE上行链路而专门配置的。每一GbE埠能以10/100/1000 Megabits模式工作，而每一10GbE端口能够以10GbE模式或堆栈模式工作。此外，BCM56504是基于每秒可处理超过1亿包的72Gbps包处理器，这一能力在集成多层交换机领域无可匹敌。
Announced product is the first StrataXGS III product family, the 500 Series. Designed for feature-rich, high performance Gigabit Ethernet (GbE) and 10GbE switch applications, the 500 Series includes five new chips, the BCM56500, BCM56501, BCM56502, BCM56503 and BCM56504, each targeting different port and functionality requirements. The flagship product, the BCM56504, is the only switch in the industry to incorporate 24 GbE ports and four 10GbE ports in a single-chip device. This specific configuration is required by network integrators to support concurrent stacking and redundant 10GbE uplinks. Each GbE port can operate at 10/100/1000 Megabits per second (Mbps) while each 10GbE port can operate in either 10GbE mode or stacking mode. Additionally, the BCM56504 is based on a 72 Gbps packet processor that is capable of processing over 100 million packets per second, which is unrivaled for integrated multi-layer switches.
Ford G. Tamer.表示：“通过StrataXGS III产品，我们正在提供一种令人振奋的新一代交换机芯片，它能够在单个的高性能网络上实现话音、视频和数据流的安全可靠通讯。继承StrataSwitch和StrataXGS前几代产品成功的模式，StrataXGS III将多项独到的技术集于一体，这些技术将在未来几年为世界最先进的企业和运营商网络提供动力。”
"With StrataXGS III, we are delivering an exciting new generation of switching silicon that enables reliable and secure communication of voice, video and data traffic on a single high-performance network," said Ford G. Tamer, Ph.D.,Group Vice President, Networking Infrastructure, Broadcom. "Building on the success formula of the previous generations of StrataSwitch and StrataXGS, StrataXGS III features an impressive collection of unique technologies that will power the world‘s most advanced enterprise and carrier networks over the next several years."
致力于丰富的安全性、弹性和融合统一的网络
Focus on Robust Security, Resiliency and Converged Unified Networking
随着公众网络和公司网络受到更加频繁的针对性攻击，Broadcom给与充分的响应，通过在所有StrataXGS III产品上集成大量独一无二的基于安全的智能，而实现具有弹性的、安全可靠的网络连接。Broadcom设计了独特的线速2层到7层对应用感知的安全技术，这一基于灵活可编程规则的技术加强了安全策略。另一个产品特性是集成了防止拒绝服务攻击的技术，即使受到攻击也能保证连续的服务。为了在所有的StrataXGS III产品中确保安全功能，先进的密码加密技术也被集成其中，满足美国联邦政府FIPS 140-2标准所规定的严格要求。
With the increasing rate of targeted attacks on public and corporate networks, Broadcom has responded to the need for resilient secure networking by integrating a wealth of unique security-based intelligence into all StrataXGS III products. Broadcom‘s exclusive wire-speed Layer 2 to Layer 7 application-aware security technology is designed to enforce secure policies based on a flexible variety of programmable rules. Also featured is integrated Denial of Service attack prevention technology that provides continuity of service to users in case of an attack. To complete the security features within all StrataXGS III products, advanced cryptographic technology is integrated that meets the stringent requirements defined by the U.S. Government‘s FIPS 140-2 standard.
基于下一代安全特征，StrataXGS III架构能实现无线和有线基础设施的无缝集成。过去，由于涉及管理分散的WLAN网络和配置昂贵设备的开支及复杂性，WLAN的使用曾受到限制。StrataXGS III架构通过集成安全的WLAN服务和快速的漫游技术而解决这些问题，消除对昂贵设备的需求。因此，IT专业人员可以在一体化的网络中配置成本合理且易于管理的WLAN服务，比如新的VoIP无线电话服务。
Building upon next-generation security features, the StrataXGS III architecture enables seamless integration of a unified wireless and wired infrastructure. In the past, WLAN adoption has been limited due to the cost and complexity of deploying expensive appliances and managing a separate WLAN network. The StrataXGS III architecture solves these problems by integrating secure WLAN services and fast roaming technology, eliminating the need for costly appliances. As a result, IT professionals can now deploy cost-effective and easy to manage WLAN services, such as new VoIP wireless phones, on a single unified network.
由于因特网难以置信地持续增长，估计不久即将面临IPv4地址短缺。一个称为IPv6的新协议解决方案可以提供几乎无限制的地址空间。为了支持这种技术趋势，StrataXGS III架构提前实现技术的迁移，完全集成了IPv4和IPv6路由功能。采用这一高性价比技术能够帮助企业和服务提供商的网络实现轻松而平滑移植到IPv6。另外，智慧IP多播业务同样是StrataXGS III交换机的特点，它可以让服务提供商提供三种新类型（话音、视频和数据）的服务能力和视频播放服务。
As the Internet continues to experience incredible growth, it is expected that there will be a shortage of IPv4 addresses in the future, prompting a new protocol solution called IPv6 that provides virtually unlimited address space. In support of this trend, the StrataXGS III architecture is ahead of this transition by fully integrating both IPv4 and IPv6 routing capabilities. This cost-effective implementation will enable the easy migration to IPv6 in corporate and service provider networks. In addition, intelligent IP multicast technology is also featured within StrataXGS III switches, enabling service providers to offer new triple play capabilities (voice, video and data) and video broadcasting services.
为了降低系统开发成本和缩短产品投入市场时间，Broadcom提供一个完整的API （应用程序接口），它保持了和以往几代Broadcom交换机软件包的兼容性。除了提供一个公共的API，Broadcom为 StrataXGS III产品系列提供参考设计，包括软件、图表、规划文件和相关文档。
To reduce system development costs and accelerate time to market, Broadcom provides a comprehensive application programming interface (API) that maintains software compatibility with previous generations of Broadcom switches. In addition to providing a common API, Broadcom provides reference designs for the StrataXGS III product series including software, schematics, layout files and related documentation.
StrataXGS III应用
StrataXGS III交换机芯片系列非常适合单机、可堆栈及机架交换机配置方式，充分适应企业、服务提供商和网格计算的市场需求。另外，这些设备非常适合刀片服务器、IP DSLAM(IP协议数字用户线访问多路器)、PON（无源光网络）和AdvancedTCA（高级电信计算架构）等嵌入式应用，提供可靠的局部、背板和机板间的交换。
Application
The StrataXGS III family of switch chips is ideal for standalone, stackable and chassis switch configurations supporting enterprise, service provider and grid computing markets. In addition, these devices are well-suited for use in embedded applications such as blade servers, IP DSLAM (Internet protocol digital subscriber line access multiplexers), PON (passive optical networking), and Advanced TCA (Advanced telecom computing architecture), providing reliable local, backplane and inter-shelf switching.
